Philips CBTD3306 - Manual (Page 13)

CBTD3306 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 1 May 2012 13 of 17
NXP Semiconductors
CBTD3306
Dual bus switch with level shifting
Fig 17. Package outline SOT902-2 (XQFN8)
References Outline
version European
projection
Issue date
IEC JEDEC JEITA
SOT902-2 - - - MO-255 - - -
sot902-2_po
10-11-02
11-03-31
Unit (1)
mm
max
nom
min
0.5 0.05
0.00
1.65
1.60
1.55 1.65
1.60
1.55
0.55 0.5
0.15
0.10
0.05
0.1 0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-2
A 1 b
0.25
0.20
0.15
D E e e 1 L
0.35
0.30
0.25
L 1 v w
0.05
y y 1
0.05
0 1 2 mm
scale
terminal 1
index area
B A D
E
X
C
y C y
1
terminal 1
index area
3
L
L 1
b
e 1
e
A C B v
C w
2
1
5
6
7
metal area
not for soldering
8
4
A
1
A
detail X