Philips CBTD3306 - Manual (Page 11)

CBTD3306 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 1 May 2012 11 of 17
NXP Semiconductors
CBTD3306
Dual bus switch with level shifting
Fig 15. Package outline SOT530-1 (TSSOP8)
UNIT A1
A
max.
A2 A3 bp L HE Lp w y v c e D (1) E (2) Z (1) θ
REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05 0.95
0.85 0.30
0.19 0.20
0.13 3.1
2.9 4.5
4.3
0.65
6.5
6.3 0.70
0.35 8 °
0 °
0.1 0.1 0.1 0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.5
SOT530-1 MO-153
00-02-24
03-02-18
w M
bp
D
Z
e
0.25
1 4
8 5
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v M A
X
A
y
2.5 5 mm 0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1
1.1
pin 1 index