Philips BGD502 - Manual (Page 5)

2001 Nov 15 5
NXP Semiconductors Product specification
550 MHz, 18.5 dB gain power doubler
amplifier
BGD502
PACKAGE OUTLINE
UNIT
A2
max.
c e e1 q
Q
max.
q1 q2 U2 U1 W
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm 20.8 9.5
0.51
0.38
0.25 27.2
2.04
2.54
13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4 38.1 25.4 10.2 4.2
44.75
44.25 8.2
7.8
0.25 0.1 3.8
b F p
6-32
UNC
y w
0.7
x S
DIMENSIONS (mm are the original dimensions)
SOT115J
0 5 10 mm
scale
A
max.
D
max.
L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
D
U1 q
q2
q1
b
F
S
A
Z p E
A2
L
c
d
Q U2
M w
7 8 9 2 3
W e
e1
5
p
1
d
x M B
y M B
B
04-02-04
10-06-18
y M B