Package outline unit: mm, Sony corporation – Symbol Technologies CMOS CXP854P60 User Manual
Page 21
– 21 –
CXP854P60
Package Outline
Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
23.9
±
0.4
20.0 – 0.1
0.4 – 0.1
+ 0.15
14.
0
–
0.
1
1
19
20
32
33
51
52
64
0.15 – 0.05
+ 0.1
2.75 – 0.15
16.
3
0.1 – 0.05
+ 0.2
0.
8
±
0.
2
M
0.2
0.15
+ 0.4
17.9
±
0.4
+ 0.
4
+ 0.35
64PIN QFP (PLASTIC)
QFP-64P-L01
P-QFP64-14x20-1.0
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
1.5g
1.0
0
˚
to10
˚
SONY CODE
EIAJ CODE
JEDEC CODE
23.9
±
0.4
20.0 – 0.1
0.4 – 0.1
+ 0.15
14.
0
–
0.
1
1
19
20
32
33
51
52
64
0.15 – 0.05
+ 0.1
2.75 – 0.15
16.
3
0.1 – 0.05
+ 0.2
0.
8
±
0.
2
M
0.2
0.15
+ 0.4
17.9
±
0.4
+ 0.
4
+ 0.35
64PIN QFP (PLASTIC)
QFP-64P-L01
P-QFP64-14x20-1.0
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
1.5g
1.0
0
˚
to10
˚
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL
ALLOY 42
LEAD TREATMENT
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS
5-18
µ
m
SPEC.
Sony Corporation