Chapter 9 package outline, Table 9.1 80 pin tqfp package parameters, Chapter 9 – SMSC USB2507 User Manual
Page 44: Package outline, Datasheet
Integrated USB 2.0 Compatible 7-Port Hub
Datasheet
Revision 2.3 (08-27-07)
44
SMSC USB2507
DATASHEET
Chapter 9 Package Outline
Figure 9.1 80 Pin TQFP Package Outline (12x12x1.4 mm body - 2 mm footprint)
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane
H.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 9.1 80 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
1.40
~
1.60
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
1.35
1.40
1.45
Body Thickness
D
13.80
14.00
14.20
X Span
D1
11.80
12.00
12.20
X body Size
E
13.80
14.00
14.20
Y Span
E1
11.80
12.00
12.20
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00 REF.
~
Lead Length
e
0.50 Basic
Lead Pitch
q
0
o
~
7
o
Lead Foot Angle
W
0.17
0.18
0.27
Lead Width
ccc
~
~
0.08
Coplanarity