Interlink Electronics VersaPad PS2 User Manual
Page 9
www.interlinkelectronics.com
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PS2 VersaPad®
Integration Guide
5.1.4 PCB Support
The clamping parts used to secure the PCB component side of the VersaPad module
should provide additional support wherever it is allowable.
5.1.5 Enclosure
Material
Bezels and encasements can be made of conductive or non-conductive materials.
Proper care should be taken to avoid creating ESD concerns
5.1.6 Critical Capture Dimensions
The figure below shows the critical dimensions in positioning of the bezel or top
case, gasket, VersaPad, and enclosure. These recommendations are chosen to
prevent embossing near the spacer and to prevent inadvertent pressure on the top
surface of the sensor. All dimensions and tolerances apply to both top and bottom
mounting methods.
Figure 5: Critical capture dimensions. All dimensions are in mm. Drawing not to scale.