HP PAVILION DV8 User Manual

Page 96

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4–62

Maintenance and Service Guide

Removal and replacement procedures

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:

Thermal paste is used on the processor 1 and the heat sink section 2 that services it.

Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.

Thermal pads are used on various other system board components 5 and 7, and heat sink sections 6 and 8
that service them.

Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare
part kits.

Reverse this procedure to install the fan/heat sink assembly.