Lanner LEC-2055 - Manual (Page 16)

16
Hardware Setup
Chapter 4
Embedded and Industrial Computing
Chapter 4:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from
the server. The power switch button does not
completely shut off system power. Portions of the
power supply and some internal circuitry remain
active until AC power is removed.
Unpower the LEC-2055 and remove the power cord. 1.
Turn the device upside down. 2.
Unscrew the 4 rubber feet from the bottom cover. 3.
Open the cover. 4.
Installing the System Memory
The motherboard supports DDR2 memory to meet the
higher bandwidth requirements of the latest operating
system and Internet applications. It comes with one
Double Data Rate(DDR2) Small Outline Dual Inline Memory
Module (SO-DIMM) socket.
Align the memory module’s cutout with the SO-DIMM 1.
socket’s notch.
Install the SO-DIMM.
2.
Note:
The system can support memory with the
DDR2 400/533 SO-DIMM socket up to 2 GB in
maximum.
Installing a CompactFlash Card
LEC-2055 provides one CompactFlash slot. Follow the
procedures bellow for installing a CompactFlash card.
Align CompactFlash card and the card slot with the 1.
arrow pointing toward the connector.
Push the card and insert it into place.
2.
2
1
1
2