3 acronyms, abbreviations and definitions, 1 acronyms and abbreviations, 2 definitions – Sundance DVIP User Manual
Page 6: Acronyms, abbreviations and definitions, Acronyms and abbreviations, Definitions

3 Acronyms, Abbreviations and Definitions
3.1 Acronyms and Abbreviations
TIM
Texas Instruments Module
DSP
Texas Instrument Digital Signal Processor
Comport Communication Port. Standard communication interface developed by T.I
FPGA
Xilinx Field Programmable Gate Array.
SLink
Sundance link. High-speed Parallel port
CP ComPort.
Communication
interface
RSL
Rocket Serial Link
SHB
Sundance High-Speed Bus. Communication interface
DDR Dual
Data
Rate
TxCy
Denomination for TIM site x Comport y. x=1, 2, 3, 4 and y=0, 1, 2, 3, 4, 5
on a TIM carrier board.
VP Video
port
IP Input
port
OP Output
port
3.2 Definitions
DSP Module
Typically a TIM module hosting a TI DSP and, a Xilinx FPGA.
FPGA-only Module
A TIM with no on-board DSP, where the FPGA provides all
functionality.
Firmware
A proprietary FPGA design providing some sort of functionality.
Sundance Firmware is the firmware running in an FPGA on a DSP
Module or on FPGA-only Module
Root
The starting point in every Diamond application is a processor
(DSP or FPGA) called root. The root acts as the base of the
network and a reference for locating all other processors.
Node
It is a processor (DSP or FPGA) that can be reached from the root
by following wires through other processors
User Manual for DVIP
Page 6 of 11
Last Edited: 30/09/2009 14:51:00