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3 acronyms, abbreviations and definitions, 1 acronyms and abbreviations, 2 definitions – Sundance DVIP User Manual

Page 6: Acronyms, abbreviations and definitions, Acronyms and abbreviations, Definitions

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3 Acronyms, Abbreviations and Definitions

3.1 Acronyms and Abbreviations

TIM

Texas Instruments Module

DSP

Texas Instrument Digital Signal Processor

Comport Communication Port. Standard communication interface developed by T.I
FPGA

Xilinx Field Programmable Gate Array.

SLink

Sundance link. High-speed Parallel port

CP ComPort.

Communication

interface

RSL

Rocket Serial Link

SHB

Sundance High-Speed Bus. Communication interface

DDR Dual

Data

Rate

TxCy

Denomination for TIM site x Comport y. x=1, 2, 3, 4 and y=0, 1, 2, 3, 4, 5
on a TIM carrier board.

VP Video

port

IP Input

port

OP Output

port

3.2 Definitions

DSP Module

Typically a TIM module hosting a TI DSP and, a Xilinx FPGA.

FPGA-only Module

A TIM with no on-board DSP, where the FPGA provides all
functionality.

Firmware

A proprietary FPGA design providing some sort of functionality.
Sundance Firmware is the firmware running in an FPGA on a DSP
Module or on FPGA-only Module

Root

The starting point in every Diamond application is a processor
(DSP or FPGA) called root. The root acts as the base of the

network and a reference for locating all other processors.

Node

It is a processor (DSP or FPGA) that can be reached from the root
by following wires through other processors





User Manual for DVIP

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Last Edited: 30/09/2009 14:51:00