1 introduction, 2 related documents, 1 referenced documents – Sundance DVIP User Manual
Page 5: 2 applicable documents, Introduction, Related documents, Referenced documents, Applicable documents
1 Introduction
The DVIP (Digital Video Infrastructure Platform) is based on the latest 1GHz
DSP which offers the highest fixed-point processing of any
commercial available TI DSPs and a scalable architecture that allows multiple DSP to
be connected via a Serial Rapid I/O (SRIO) interface and this concept is well suited to
the Sundance's Modular hardware concept that follows the TIM (Texas Instrument
Module) standard. The basic configuration has a
Dual 'C6455 DSP Module
and a
Image Module hosted on a
stand-alone carrier
board. The DVIP can be upgraded with another 2x Modules from the range of over
40 different combinations, offering more processing-power, high-speed ADC/DAC
interface, RF test-bed or custom-bespoke hardware.
DVIP is designed for high-performance, semi-rugged mobile and stationary
deployment or for "Rapid Prototyping" of algorithms or hardware concepts. The
SMT148-FX carrier board offers SATA, USB 2.0, FireWire, 1Gigabit Ethernet, RS485,
RS232, LVDS interfaces. It also contains a Virtex-4 FX60 FPGA that includes two
PowerPC cores and these can be used as controller for above interfaces, leaving the
DSPs free for processing.
The DVIP is supported by TI's Code Composer Studio 3.3 and is required for any
development of DSP code. No run-time licensees are required for the this OEM
hardware platform and DVIP is furthermore Diamond® compatible and these tools
offer a integrated development environment (IDE) for the DSP, FPGA and PowerPC
based on the Eclipse front-end.
2 Related Documents
2.1 Referenced Documents
3L Diamond©
2.2 Applicable Documents
All the Sundance products User Guides are available from our website:
User Manual for DVIP
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Last Edited: 30/09/2009 14:51:00