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2 specifications and documents – BECKHOFF CB4053 User Manual

Page 12

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Chapter: Overview

Specifications and Documents

page 12

Beckhoff New Automation Technology CB4053

2.2 Specifications and Documents

In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.

§ ISA Specification

IEEE996P

www.ieee.org

§ PC/104™ Specification

Version 2.5

www.pc104.org

§ PC/104-Plus™ Specification

Version 2.0

www.pc104.org

§ PCI Specification

Version 2.3 and 3.0

www.pcisig.com

§ ACPI Specification

Version 3.0

www.acpi.info

§ ATA/ATAPI Specification

Version 7 Rev. 1

www.t13.org

§ USB Specifications

www.usb.org

§ SM-Bus Specification

Version 2.0

www.smbus.org

§ Intel® Chipset Description

SCH Datasheet

www.intel.com

§ Intel® Chip Description

Atom® Datasheet

www.intel.com

§ Winbond® Chip Description

W83627HF

www.winbond-usa.com or www.winbond.com.tw

§ Fintek® Chip Description

F85226F Datasheet

www.fintek.com.tw

§ Intel® Chip Description

82574L Datasheet

www.intel.com

This manual is related to the following products: