BECKHOFF CB4050 - Manual (Page 12)

Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB4050
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
§ ISA specification
IEEE996P
www.ieee.org
§ PC/104™ specification
revision 2.5
www.pc104.org
§ PC/104-Plus™ specification
revision 2.0
www.pc104.org
§ PCI specification
revision 2.3 resp. 3.0
www.pcisig.com
§ ACPI specification
revision 3.0
www.acpi.info
§ ATA/ATAPI specification
version 7 rev. 1
www.t13.org
§ USB specifications
www.usb.org
§ SM-Bus specification
revision 2.0
www.smbus.org
§ Intel® chipset description
855GM/GME Datasheet, Design Guide
www.intel.com
§ Intel® chipset description
ICH4 Datasheet
www.intel.com
§ Intel® chip description
Celeron® M, Pentium® M
www.intel.com
§ Winbond® chip description
W83627HF, W83626 Datasheet
www.winbond-usa.com oder www.winbond.com.tw
§ Fintek® chip description
F85226F Datasheet
www.fintek.com.tw
§ Intel® chip description
82562EZ Datasheet
www.intel.com
§ Intel® chip description
82551ER Datasheet
www.intel.com
§ ICS® chip description
ICS950813 Datasheet
www.icst.com