ADLINK aTCA-9710 - Manual (Page 18)

18
3 Functional Description
3.1 CPU, Memory and Chipset
3.1.1 CPU
The Intel® Xeon® processor E5-2658 v3 implements several key technologies:
‹
Four channel Integrated Memory Controller supporting DDR4
‹ Integrated I/O with up to 40 lanes for PCI Express Generation 3.0
‹ Two point-to-point link interface based on Intel® QuickPath Interconnect (Intel® QPI) up
to 9.6GT/s
‹ 30 MB of shared cache
The Intel® Xeon® processor E5-2658 v3 supports several advanced technologies:
‹
Intel® 64 Technology
‹ Enhanced Intel® SpeedStep® Technology
‹ Intel® Virtualization Technology (Intel® VT)
‹ Intel® Hyper-Threading Technology (Intel® HT Technology)
The Intel® Xeon® processor E5-2658 v3 has a maximum TDP of 105W and has an elevated
case temperature specification. The elevated case temperatures are intended to meet the
short-term thermal profile requirements of NEBS Level 3. The Intel® Xeon® processor E5-
2658 v3 is ideal for thermally constrained form factors in embedded servers, communications
and storage markets.
Supported Processors, Maximum Power Dissipation
The following table describes the Intel® Xeon® processor E5 family CPUs supported by the
aTCA-9710:
Name E5-2658 v3
L2 cache 30MB
Clock 2.2GHz
QPI 9.6
GT/s
TDP 105W