Mag Layers USA RT11H07 User Manual
Page 5
Wave Soldering
●
Tip Temperature :265
º
C MAX.
●
Tip Temperature Time: 4sec MAX.
Time(sec)
Te
m
pe
ra
tu
re
(°
C
)
60~90 sec
Preheat area
100~110°C
Removal of oxide film
Peak temp 255~265°C
30~50 sec
Cooling
90°C
Liquefaction of flux
Activation of activator
3~4 sec
Evaporation of solvent
Liquefaction of flux
Melting and wetting
See also other documents in the category Mag Layers USA Hardware:
- GMLI-201209/12 (9 pages)
- GMPI-201205 F1 (8 pages)
- GMPI-201209 F1 (8 pages)
- GMPI-201610 F1 (8 pages)
- GMPI-252005 F1 (8 pages)
- GMPI-252010 F1 (8 pages)
- GMPI-252012 F1 (8 pages)
- GMLB-3216 A (8 pages)
- GMLB-3216 B (8 pages)
- GMLB-160808 (9 pages)
- GMLB-160808 (10 pages)
- GMLB-100505 (8 pages)
- GMLB-201209 (10 pages)
- GMLB-201209 (9 pages)
- GMLB-060303 (8 pages)
- Chip Antenna (3 pages)
- PCB Antenna (1 page)
- FPC Antenna (1 page)
- Metal Stamping Antenna (1 page)
- External Dipole Antenna (2 pages)
- Low Pass Filter (3 pages)
- Balun (4 pages)
- Diplexer (5 pages)
- Balance Filter (3 pages)
- Coupler (2 pages)
- MSI-200904CP (10 pages)
- MSI-280904CP (10 pages)
- MSI-101004PF (9 pages)
- MCI-2012 (9 pages)
- MCM-7060M (8 pages)
- MCM-9070M (8 pages)
- MCM-1211M (9 pages)
- MHSC-1608C (9 pages)
- MHSC-2012C (8 pages)
- MHSC-2520C (8 pages)
- MHQC-2520C (8 pages)
- SMB-403025 (7 pages)
- SMB-853025 (8 pages)
- MSI-700705 (9 pages)
- MSI-100705 (9 pages)
- MSI-110708 (9 pages)
- MSI-111109 (4 pages)
- MSI-131308 (4 pages)
- MSI-400404 (11 pages)
- MSI-600608 (10 pages)