Pre-heating, So ld er in g – Mag Layers USA RT22P04 User Manual
Page 5
Reflow Soldering
Natural
cooling
260°C
Time(s)
Te
m
pe
ra
tu
re
(°
C)
●
IR Reflow soldering :
Preheat at 3
℃
per second to 160
℃
and using lead free solder ,
IR at 260
℃
for 10 seconds.
●
Rework flow:
Component must withstand two IR reflow cycles with a cool down
between cycles
●
Temperature is measured at the terminal portion of product
(Using thermocoupler for measurement).
●
This profile is reference data we recommend. Please check in your
actual process.
●
For reliable soldering, the thickness of solder paste screen should
be over the terminal co-planality.
●
The cutted end of terminal has no plating
(out of subject of solder ability).
160°C
53sec TYP.
3°C /sec MAX.
Pre-heating
60sec MIN.
120sec MAX.
2.5°C /sec MAX.
-3°C /sec MAX.
So
ld
er
in
g
See also other documents in the category Mag Layers USA Hardware:
- GMLI-201209/12 (9 pages)
- GMPI-201205 F1 (8 pages)
- GMPI-201209 F1 (8 pages)
- GMPI-201610 F1 (8 pages)
- GMPI-252005 F1 (8 pages)
- GMPI-252010 F1 (8 pages)
- GMPI-252012 F1 (8 pages)
- GMLB-3216 A (8 pages)
- GMLB-3216 B (8 pages)
- GMLB-160808 (9 pages)
- GMLB-160808 (10 pages)
- GMLB-100505 (8 pages)
- GMLB-201209 (10 pages)
- GMLB-201209 (9 pages)
- GMLB-060303 (8 pages)
- Chip Antenna (3 pages)
- PCB Antenna (1 page)
- FPC Antenna (1 page)
- Metal Stamping Antenna (1 page)
- External Dipole Antenna (2 pages)
- Low Pass Filter (3 pages)
- Balun (4 pages)
- Diplexer (5 pages)
- Balance Filter (3 pages)
- Coupler (2 pages)
- MSI-200904CP (10 pages)
- MSI-280904CP (10 pages)
- MSI-101004PF (9 pages)
- MCI-2012 (9 pages)
- MCM-7060M (8 pages)
- MCM-9070M (8 pages)
- MCM-1211M (9 pages)
- MHSC-1608C (9 pages)
- MHSC-2012C (8 pages)
- MHSC-2520C (8 pages)
- MHQC-2520C (8 pages)
- SMB-403025 (7 pages)
- SMB-853025 (8 pages)
- MSI-700705 (9 pages)
- MSI-100705 (9 pages)
- MSI-110708 (9 pages)
- MSI-111109 (4 pages)
- MSI-131308 (4 pages)
- MSI-400404 (11 pages)
- MSI-600608 (10 pages)