Mag Layers USA MHSC-2520C - Manual (Page 3)

(4) RELIABILITY TEST METHOD
Item Specifications Test conditions
Solderability The metalized area must have 95% Dip pads in flux and dip in solder pot
minimum solder coverage. (96.5 Sn/3.5 Ag solder) at 255 °C ±5°C.
Resistance to There must be no case deformation Inductors shall be reflowed onto a PC board
soldering heat or change in dimensions. using 96.5 Sn/3.5 Ag solder paste.
Inductance must not change more Solder process shall be at a maximum
than the stated tolerance. temperature of 260 °C.
For 96.5 Sn/3.5 Ag solder paste:>217 °C for
90 seconds
Vibration There must be no case deformation Solder specimen inductor on the test printed
or change in dimensions. circuit board.
Inductance must not change more Apply vibrations in each of the x,y and z directions
than the stated tolerance. for 2 house for a total of 6 hours.
Frequency : 10~50 Hz
Amplitude : 1.5mm
High There must be no case deformation Inductors shall be subjected to temperature
temperature or change in dimensions. 125 ±2℃ for 50±12 hours.
resistance
Inductance must not change more Measure the test items after leaving the
than the stated tolerance. inductors at room temperature and humidity
for 2 hours.
Static Inductors must not have a shorted Inductors shall be subjected to temperature
Humidity or open winding. 85 ±2℃ and 90 to 95%RH. for ten 24-hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
Component Inductors shall be subjected to Inductors shall be reflow soldered (255 °C
adhesion 1.8Kg ±5°C for 10 seconds) to a tinned copper
(push test) substrate. A force gauge shall be applied
to the side of the component.
The device must withstand the stated force
without a failure of the termination.
MHSC-2520C-SERIES Page-3/7
M A G . L A Y E R S