Mag Layers USA GMLB-060303 - Manual (Page 7)

MAG.LAYERS
GMLB-060303-P Series
■ ■ ■
R R R E E E L L L I I I A A A B B B I I I L L L T T T Y Y Y T T T E E E S S S T T T
•
MECHANICAL PERFORMANCE TEST
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder. Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245
±
5 ℃
Flux: Rosin
Dip Time: 3
±
1 Seconds
Soldering Heat
Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder. Solder temperature : 260
±
5 ℃
Flux: Rosin
Dip time: 10
±
1 seconds
Bending Strength
The chip shall not crack.
Vibration
Impedance shall be within
±
20% of the initial
value.
There shall be no mechanical damage.
The sample shall be soldered onto the
printed circuit board and when a vibration
having an amplitude of 1.52mm and a
frequency of from 10 to 55Hz/1 minute
repeated should be applied to the 3
directions (X,Y,Z) for 2 hours each.
Drop shock
No apparent damage Dropped onto printed circuit board from
100cm height three times in x, y, z directions.
The terminals shall be protected.
•
CLIMATIC TEST
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle) Temperature: -55 ℃ ~125 ℃ for 30
minutes each, 100 cycles.
Humidity Resistance
Temperature : 60 ℃
Humidity: 95% RH
Time: 1000
±
12 Hours
High Temperature
Resistance Temperature : 85 ℃
±
2 ℃
Time: 1000
±
12 Hours
Low Temperature
Resistance
Impedance shall be within
±
20% of the initial
value.
Temperature : -40 ℃ ±
2 ℃
Time: 1000
±
12 Hours
1. Operating Temperature Range: -55 ℃ TO +125 ℃
2. Storage Condition: The temperature should be within -40 ℃ ~85 ℃ and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.