KROHNE OPTIWAVE 5200 IECEx - Manual (Page 19)

INSTALLATION
2
19
OPTIWAVE 5200 C/F
www.krohne.com 04/2013 - 4001906102 - AD IECEX OPTIWAVE 5200 R02 en
2.2.2 Maximum surface temperature of the housing for dust applications
For more data, refer to the table for Ex ia, Ex ia tb and Ex ic devices in the "Ambient and flange
temperature" section.
2.2.3 Process pressure
WARNING!
Equipment category 1/2 D, 2 D, 3 D or EPL Da/Db, Db, Dc: Ex ia, Ex ia tb and Ex ic devices only
Equipment category 1/2 D, 2 D, 3 D or EPL Da/Db, Db, Dc: Ex ia, Ex ia tb and Ex ic devices only Equipment category 1/2 D, 2 D, 3 D or EPL Da/Db, Db, Dc: Ex ia, Ex ia tb and Ex ic devices only Equipment category 1/2 D, 2 D, 3 D or EPL Da/Db, Db, Dc: Ex ia, Ex ia tb and Ex ic devices only
If the ambient and flange temperatures of the device are not more than values given in the table
for Ex ia, Ex ia tb and Ex ic devices, the surface temperature of the housing will not be more than
+90
° C / +194 ° F.
Equipment protection level (EPL) Allowable process pressure
[kPa] [psi]
Ga/Gb 80…110 1 11.6…16 1
Others As per non-Ex device As per non-Ex device
1 Atmospheric pressure