IEI Integration IEM-LX v1.00 - Manual (Page 138)

IEM-LX-800 ETX CPU Module
Ａ
AC’97 controller
specification v2.3...................................28
ACPI ......................................13, 26, 27, 127
ACPI v2.0 ..............................................27
Address Mapping.....................................125
Advanced BIOS Features ....................58, 65
Advanced Chipset Features ..........58, 72, 73
Advanced Power Management .................13
AMD Geode LX 800.............................16, 33
AMD VGA driver ......................................107
AMD® CS5536 ..........................................18
anti-static precautions................................36
anti-static pad ........................................36
anti-static wristband...............................36
handling .................................................36
self-grounding........................................36
ASKIR ........................................................13
ATA ......................................................13, 19
AWARD BIOS ............................................19
Ｂ
baseboard..........................18, 52, 53, 54, 57
BIOS .. 12, 13, 19, 55, 56, 57, 58, 59, 60, 61,
62, 65, 72, 73, 75, 78, 79, 85, 86, 89, 90,
91, 92, 94, 115, 116, 122, 126
Ｃ
CD-ROM ....................................................67
CF Type II ..................................................18
CFII ......................................................13, 19
chipset........................................................27
Chipsets .....................................................18
CODEC ................................................... 129
COM ports..................................................18
Compact Flash...........................................13
compact flash module ................................16
CPU module...............................................98
CRT............................................... 19, 74, 75
customized platform devices .....................16
Ｄ
DDR ...........................................................16
dimensions.................................................22
board .....................................................22
DIO.............................................................13
DOS environment ................................... 122
Ｅ
electrostatic discharge ...............................36
embedded module16, 17, 18, 42, 51, 52, 53,
54
Embedded Technology eXtended..............16
ETX form factor..........................................16
ETX-X1 connector ........................ 18, 41, 42
ETX-X2 connector ........................ 18, 41, 43
ETX-X3 connector ........................ 18, 41, 45
ETX-X4 connector ........................ 18, 41, 47
Example program ................................... 123
Ｆ
FDD..................................................... 13, 68
Floppy Disk Drive.......................................13
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