Asus TUWE-M - Manual (Page 8)

8 ASUS TUWE-M User’s Manual
2.1 The ASUS TUWE-M
The ASUS TUWE-M motherboard is carefully designed for the demanding PC user
who wants advanced features processed by the fastest processors.
2.1.1 Core Specifications
• Latest Intel Processor Support
P III
® Tualatin™ 100/133MHz FSB FC-PGA2
P III ® Coppermine™ 100/133MHz FSB FC-PGA
Celeron™ 100/66MHz FSB FC-PGA
• North Bridge System Chipset: The Intel ® 810E2 chipset supports the
latest Intel ® Tualatin™ processor and offers full backward compatibility
to PIII ® Coppermine™ and Celeron™ CPUs. The chipset supports
industry standard 66/100/133 Front Side Busses (FSBs), and up to 512MB
of PC100 SDRAM, and a 3D/2D hardware accelerator.
• South Bridge System Chipset: The Intel I/O Controller Hub 2 (ICH2)
features support for UltraDMA/100, which allows burst mode data ASUS
IrDA-compliant infrared module transfer rates of up to 100MB/sec; two
USB controllers for a total of 4 USB ports.
• Intel ® Accelerated Hub Architecture: Features a dedicated high speed
hub link between the ICH2 and GMCH with a bandwidth of 266MB/sec
– twice the maximum bandwidth of the PCI bus.
• PC100 Memory Support: Equipped with two Dual Inline Memory Mod-
ule (DIMM) sockets to support PC100-compliant non-ECC SDRAMs
(available in 64, 128, 256 densities) up to 512MB.
• High-Speed Data Transfer Interface: UltraDMA/100 increases the data
transfer rate to 100MB/s. UltraATA/100 is backward compatible with
both DMA/66 and DMA/33 with existing DMA devices and systems.
(UltraDMA100/66 requires a 40-pin 80-conductor cable to be enabled.)
• Super Multi-I/O: Provides two high-speed UART compatible serial ports
and one parallel port with EPP and ECP capabilities. UART2 can
also be directed from COM2 to the Infrared Module for wireless
connections.
• Onboard LAN: Provides Intel’s 82562ET chipset, an integrated
Platform LAN Connect (PLC) device with 10BASE-T/100BASE-TX
capabilities. Network connectivity is integrated through the Intel I/O
Controller Hub 2 (ICH2), which offers enhanced bus mastering for
high-speed data transfers. The bus mastering facility permits high-level
command processing.
• Smart BIOS: 2Mb firmware provides Vcore and CPU/SDRAM
frequency adjustments, boot block write protection, and HD/SCSI/MO/
ZIP/CD/Floppy boot.
2. FEATURES
Specifications
2. FEA
TURES