Asus M5A97 PRO - Manual (Page 14)

1-2 Chapter 1: Product Introduction
Chapter 1
1.3 Special features
1.3.1 Product highlights
AMD ® Socket AM3+; AMD ® FX / Phenom™ II / Athlon™ II / Sempron™ 100
Series Processors
This motherboard supports AMD ® AM3+ / AM3 multi-core processors with unique L3 cache
and delivers better overclocking capabilities with less power consumption. It features
dual-channel DDR3 memory support and accelerates data transfer rate up to 4800MT/s via
HyperTransport™ 3.0 based system bus. This motherboard also supports AMD ® CPUs in the
new 32nm manufacturing process.
AMD ® 970 chipset
AMD ® 970 Chipset is designed to support up to 4800MT/s HyperTransport™ 3.0 (HT 3.0)
interface speed and PCI Express™ 2.0 x16 graphics. It is optimized with AMD ® ’s latest AM3+
and multi-core CPUs to provide excellent system performance and overclocking capabilities.
ATI Quad-GPU CrossFireX™ Support
ATI's CrossFireX™ boosts image quality along with rendering speed, eliminating the
need to scale down screen resolution to get high quality images. CrossFireX™ allows
higher antialiasing, anisotropic filtering, shading and texture settings. Adjust your display
configurations, experiment with the 3D settings, and check the effects with a real-time 3D-
rendered previews within ATI Catalyst™ Control Center.
Dual-Channel DDR3 2133(O.C.) / 1866 / 1800 / 1600 / 1333 / 1066 Support
The motherboard supports DDR3 memory that features data transfer rates of 2133(O.C.) /
1866 / 1800 / 1600 / 1333 / 1066 MHz to meet the higher bandwidth requirements of
the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3
architecture enlarges the bandwidth of your system memory to boost system performance.
AMD SB950 Chipset
The AMD ® SB950 Southbridge Chipset natively supports the next-generation Serial ATA
(SATA) interface, delivering up to 6.0 Gb/s data transfer.
True USB 3.0 Support
Experience ultra-fast data transfers at 4.8Gbps with USB 3.0 - the latest connectivity
standard. Built to connect easily with next generation components and peripherals, USB 3.0
transfers data 10X faster and is also backward compatible with USB 2.0 components.
1.3.2 Dual Intelligent Processors 2 with DIGI+ VRM
The world’s first Dual Intelligent Processors from ASUS pioneered the use of two onboard
chips—EPU (Energy Processing Unit) and TPU (TurboV Processing Unit). New generation
Dual Intelligent Processors 2 with DIGI+ VRM digital power design launch control into a new
era, empowering users with superior flexibility and perfect precision to ensure optimized
performance, extreme system stability and greater power efficiency.