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Asus P5K3 Premium/WiFi-AP User Manual

Page 21

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ASUS P5K3 Premium

1-5

New Generation 8-Phase Power Design
The ASUS 8-Phase Power Design provides highly efficient operation to

generate less heat (at least 18°C (32.4°F)) than other conventional 8-phase

power solutions. It reduces input ripple current and output ripple voltage,

which keeps CPU and power module from suffering the risk of high power

stress. It has the advantages of quick transient response and stability,

especially beneficial when CPU requires more current immediately under

heavy loading or overclocking mode.

Fanless Design - Stack Cool 2
ASUS Stack Cool 2 is a fan-less and zero-noise cooling solution that lowers

the temperature of critical heat generating components. The motherboard

uses a special design on the printed circuit board (PCB) to dissipate heat

these critical components generate.

Fanless Design - Pure Copper Heat-pipe
The Heat Pipe design effectively directs the heat generated by the chipsets to

the heatsink near the back IO ports, where it can be carried away by existing

airflow from CPU fan or bundled optional fan. The purpose of the innovative

heat pipe design on this motherboard is that the groundbreaking fanless

design does not have lifetime problems as a chipset fan does. Furthermore, it

provides options for users to install side-flow fan or passive cooler. The Heat

Pipe design is the most reliable fanless thermal solution to date.

Optional Fan (for Water-Cooling or Passive-Cooling only)
The optional fan is specifically designed to provide sufficient airflow over the

CPU power modules and chipset area when water-cooling or passive-cooling

is utilized, ensuring effective heat dissipation for the entire system. See page

2-32 for details.

Q-Fan 2
ASUS Q-Fan2 technology intelligently adjusts both CPU fan and chassis fan

speeds according to system loading to ensure quiet, cool and efficient operation.

See page 4-28 and 5-23 for details.

DO NOT uninstall the heat-pipe by yourself. Doing so may bend the tubing and

affect the heat dissipation performance.