Asus F1A55-M LX3 R2.0 - Manual (Page 8)

viii
(continued on the next page)
F1A55-M LX3 R2.0 Series specifications summary
APU AMD ® A- & E2- series accelerated processors with AMD ® Radeon™ HD
6000 series graphics, up to 4 CPU cores, FM1 package
DirectX ® 11 support
AMD ® Turbo Core Technology 2.0 support*
* The AMD ® Turbo Core Technology 2.0 support depends on the APU
types.
** Refer to www.asus.com for the AMD ® CPU support list.
Chipset AMD ® A55 FCH (Hudson D2)
Memory Dual-channel memory architecture
2 x 240-pin DIMM slots support maximum 32GB unbuffered non- ECC
DDR3 1866 / 1600 / 1333 / 1066 MHz memory modules
* The maximum 32GB memory capacity can be supported with 16GB or
above DIMMs. ASUS will update the memory QVL once the DIMMs are
available in the market.
** Refer to www.asus.com for the latest Memory QVL (Qualified Vendors
List).
*** When you install a total memory of 4GB capacity or more, Windows ®
32-bit operating system may only recognize less than 3GB. We
recommend a maximum of 3GB system memory if you are using a
Windows ® 32-bit operating system.
Graphics Integrated AMD ® Radeon™ HD 6000 series graphics in the LIano APU
Supports D-Sub with max. resolution up to 1920 x 1600 @60Hz
Supports Microsoft
® DirectX 11
Expansion slots 1 x PCIe 2.0 x16 slot
1 x PCIe 2.0 x1 slot
1 x PCI slot
Storage / RAID AMD ® A55 FCH southbridge:
- 4 x Serial ATA 3.0Gb/s connectors support RAID 0, RAID 1, RAID 10,
and JBOD configurations
LAN Qualcomm Atheros ® 8161 Gigabit LAN controller
Audio Realtek ® ALC887 3-jack 8-channel High Definition Audio CODEC*
* Use a chassis with HD audio module in the front panel to support an
8-channel audio output.
USB AMD ® A55 FCH southbridge:
- 8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the back
panel)