16 chapter 1: product introduction – Asus P5E3 Pro User Manual
Page 26

1-16
Chapter 1: Product introduction
P5E3 PRO Motherboard Qualified Vendors Lists (QVL)
DDR3-1600 MHz capability
Vendor
Part No.
Size
SS/
DS
Chip
Brand
Chip NO.
“Timing
Dimm(Bios)”
Voltage
DIMM support
A*
B*
A-Data
AD31600X001GMU
2048MB(Kit of 2)
SS N/A
Heat-Sink Package 7-7-7-20
1.75-1.85V
•
•
A-Data
AD31600E002GU
2048MB
DS N/A
Heat-Sink Package 7-7-7-20
1.75-1.85V
A-Data
AD31600X002GMU
4096MB(Kit of 2)
DS N/A
Heat-Sink Package 7-7-7-20
1.75-1.85V
•
•
Corsair
CM3X1G1600C9DHX
2048MB(Kit of 2)
SS N/A
Heat-Sink Package 9-9-9-24
1.8V
•
•
Corsair
CM3X2048-1600C9DHK
2048MB
DS N/A
Heat-Sink Package
•
Corsair
CM3X2G1600C9DHX
2048MB
DS N/A
Heat-Sink Package
•
•
Crucial
BL12864BA1608.8SFB(XMP)
3072MB(Kit of 3)
SS N/A
Heat-Sink Package 8-8-8-24
1.8V
•
•
Crucial
BL12864BE2009.8SFB3(EPP) 3072MB(Kit of 3)
SS N/A
Heat-Sink Package 9-9-9-28
2.0V
•
•
Crucial
BL25664TB1608.K16SF(XMP) 6144MB(Kit of 3)
DS N/A
Heat-Sink Package 8-8-8-24
•
•
Crucial
BL25664TG1608.K16SF(XMP) 6144MB(Kit of 3)
DS N/A
Heat-Sink Package 8-8-8-24
•
•
Crucial
BL25664TR1608.K16SF(XMP) 6144MB(Kit of 3)
DS N/A
Heat-Sink Package 8-8-8-24
•
•
G.SKILL F3-12800CL9D-2GBNQ
2048MB(Kit of 2)
SS N/A
Heat-Sink Package 9-9-9-24
1.5V~1.6V
•
•
G.SKILL F3-12800CL8T-6GBHK
2048MB
DS N/A
Heat-Sink Package 8-8-8-21
1.6~1.65
•
•
G.SKILL F3-12800CL9T-6GBNQ
6144MB(Kit of 3)
DS N/A
Heat-Sink Package 9-9-9-24
1.5V~1.6V
•
•
GEIL
GV34GB1600C8DC
2048MB
DS N/A
Heat-Sink Package 8-8-8-28
1.6V
kingmax
FLGD45F-B8KG9
1024MB
SS kingmax KFB8FNGXF-
ANX-12A
•
•
kingmax
FLGE85F-B8KG9
2048MB
DS kingmax KFB8FNGXF-
ANX-12A
•
•
Kingston KHX12800D3LLK3/3GX(XMP) 3072MB(kit of 3)
SS N/A
Heat-Sink Package 8-8-8-24
1.65V
•
•
Kingston KHX12800D3K2/4G
4096MB(kit of 2)
DS N/A
Heat-Sink Package 9-9-9-27
1.5V
•
•
Kingston KHX12800D3LLK3/6GX(XMP) 6144MB(Kit of 3)
DS N/A
Heat-Sink Package 8-8-8-24
1.65V
•
•
OCZ
OCZ3P1600EB4GK
4096MB(Kit of 2)
DS N/A
Heat-Sink Package 7-7-6-24
1.9V
•
OCZ
OCZ3SOU16004GK
4096MB(Kit of 2)
DS N/A
Heat-Sink Package 8-8-8-24
1.9V
•
•
OCZ
OCZ3X16004GK(EPP)
4096MB(Kit of 2)
DS N/A
Heat-Sink Package 7-7-7-24
1.9V
•
•
Kingtiger KTG2G1600PG3
2048MB
DS N/A
Heat-Sink Package
•
•
Mushkin
996657
4096MB(Kit of 2 )
DS N/A
Heat-Sink Package 7-7-7-20
1.95V
•
•
Mushkin
998659
6144MB(Kit of 3 )
DS N/A
Heat-Sink Package 9-9-9-24
1.5~1.6V
•
•
Mushkin
998659
6144MB(Kit of 3)
DS N/A
Heat-Sink Package 9-9-9-24
•
•
PQI
MFADR401PA0102
2048MB
DS Samsung SEC 825 HCFO
K4B1G0846D
•
•
SUPER-
TALENT
WA160UX6G9
6144MB(Kit of 3 )
DS N/A
Heat-Sink Package 9
•
•
Vendor
Part No.
Size
SS/
DS
Chip
Brand
Chip No.
CL
DIMM support
A*
B*
C*
CORSAIR
CM3X1024-1333C9DHX
1024MB
DS
N/A
Heat-Sink Package
9
•
•
KINGMAX
FLFD45F-B8EE9
1024MB
SS
ELPIDA
J1108BASE-DJ-E
N/A
•
•
•
Kingston
KVR1333D3N8/1G
1024MB
DS
QIMONDA
IDSH51-03A1F1C-13G
N/A
•
MICRON
MT8JTF12864AY-1G4BYES
1024MB
SS
MICRON
Z9HWR
9
•
•
•
MICRON
MT16JTF25664AY-1G4BYES
2048MB
DS
MICRON
Z9HWR
9
•
•
•
OCZ
OCZ3RPX1333EB2GK
1024MB
SS
N/A
Heat-Sink Package
6-5-5
•
•
•
Qimonda
IMSH1GU03A1F1C-13H
1024MB
SS
N/A
IDSH1G-03A1F1C-13H
N/A
•
•
Qimonda
IMSH2GU13A1F1C-13H
2048MB
DS
N/A
IDSH1G-03A1F1C-13H
N/A
•
•
•
SAMSUNG
M378B2873DZ1-CH9
1024MB
SS
SAMSUNG
K4B1G0846D
9
•
•
•
SAMSUNG
M391B2873DZ1-CH9
1024MB
SS
SAMSUNG
K4B1G0846D(ECC)
9
•
•
•
DDR3-1333 MHz