Ironwood Electronics SG-BGA User Manual - Manual (Page 15)

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Tel: (800) 404-0204
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Vibration
Standard:
MIL-STD202, METHOD 204, CONDITION A
No change in resistance and thickness
Humidity
Standard:
MIL-STD202, METHOD 106
Resistance change: 26 m

Thickness change: -1%
Standard: MIL-STD202, METHOD 103, CONDITION A
Resistance change: 15 m

Thickness change: -6%
Thermal Shock
Standard:
MIL-STD202, METHOD 107, CONDITION A
Resistance change: -19 m

Thickness change: -1%
Heat Sink Specifications
The graph (Figure 15) shows thermal resistance of the socket as well as socket with a fan (Papst 3412/9 GL,
35.9 CFM, 6” muffin) blowing directly on it. For high power dissipation, a specific heat sink lid can be
designed using QFIN software. Please call Ironwood Tech Support @1-800-404-0204.
0
10
20
30
40
50
0 10 20 30 40 50
Th
ermal
resis
tan
ce
(d
eg
C/W
)
IC Size (mm)
Socket+Fan
Socket Only
Trend (Socket+Fan)
Figure 15: Heat Sink Characteristics