Rainbow Electronics MAX993 User Manual
Page 2
MAX985/MAX986/MAX989/MAX990/MAX993/MAX994
Micropower, Low-Voltage, UCSP/SC70,
Rail-to-Rail I/O Comparators
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= 2.7V to 5.5V, V
EE
= 0V, V
CM
= 0V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (V
CC
to V
EE
) ...................................................6V
IN_-, IN_+ to V
EE
.......................................-0.3V to (V
CC
+ 0.3V)
OUT_ to V
EE
MAX985/MAX989/MAX993 ....................-0.3V to (V
CC
+ 0.3V)
MAX986/MAX990/MAX994.....................................-0.3V to 6V
OUT_ Short-Circuit Duration to V
EE
or V
CC
...........................10s
Continuous Power Dissipation (T
A
= +70°C)
5-Pin SC70 (derate 3.1mW/°C above +70°C) ...............247mW
5-Pin SOT23 (derate 7.10mW/°C above +70°C)...........571mW
6-Bump UCSP (derate 3.9mW/°C above +70°C)..........308mW
8-Pin SOT23 (derate 9.1mW/°C above +70°C).............727mW
8-Pin µMAX (derate 4.5mW/°C above +70°C) ..............362mW
8-Pin SO (derate 5.88mW/°C above +70°C).................471mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..........727mW
14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Reflow Temperature (Note 1) ................................+235°C
Inferred from PSRR test
CONDITIONS
V
2.5
5.5
V
CC
Supply Voltage
UNITS
MIN
TYP
MAX
SYMBOL
PARAMETER
12
20
2.5V
≤ V
CC
≤ 5.5V
dB
55
80
PSRR
Power-Supply Rejection Ratio
V
CC
= 5V
24
mV
±0.5
±5
T
A
= +25°C
V
EE
-
V
CC
+
0.25
0.25
±3
V
HYST
Input Hysteresis
Full common-mode
range
nA
I
B
Input Bias Current
(Note 5)
0.001
10
pF
1.0
C
IN
Input Capacitance
dB
52
80
CMRR
Common-Mode Rejection Ratio
pA
0.5
I
OS
Input Offset Current
±7
V
OS
Input Offset Voltage
(Note 4)
V
OUT
= high
µA
1.0
I
LEAK
Output Leakage Current
(MAX986/MAX990/
MAX994 only)
35
95
T
A
= +25°C
T
A
= -40°C to +85°C
11
20
V
CC
= 2.7V
µA
24
I
CC
Supply Current per
Comparator
T
A
= +25°C
T
A
= -40°C to +85°C
Sourcing or sinking,
V
OUT
= V
EE
or V
CC
I
SC
Output Short-Circuit Current
T
A
= +25°C
T
A
= -40°C to +85°C
T
A
= -40°C to +85°C
V
EE
V
CC
V
V
CMR
Common-Mode Voltage
Range (Note 3)
mV
V
CC
= 5V
V
CC
= 2.7V
mA
V
CC
= 5V,
I
SINK
= 8mA
0.55
0.2
0.4
V
OL
OUT Output Voltage Low
V
CC
= 2.7V,
I
SINK
= 3.5mA
V
0.4
0.15
0.3
T
A
= +25°C
T
A
= -40°C to +85°C
T
A
= +25°C
T
A
= -40°C to +85°C
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6,
Table
3 for IR/VPR and Convection Packaging
Reflow. Preheating is required. Hand or wave soldering is not allowed.