Rainbow Electronics LM32 - Manual (Page 2)

Connection Diagram
TSSOP-14
20071102
Top View
National Package Number MTC14C
Order
Number
Package
Marking
NS
Package
Number
Transport
Media
LM32CIMT LM32
CIMT
MTC14C 94 units per
rail
LM32CIMTX LM32
CIMT
MTC14C 2500 units in
tape and reel
Pin Description
Pin Number Pin Name Description Typical Connection
1, 6, 7,12, 13,
14
NC No Connect May be tied to V+, GND or left floating
2 GND Ground System ground
3 V+/+3.3V_SBY Positive power supply pin Connected system 3.3 V standby power and
to a 0.1 µF bypass capacitor in parallel with
100 pF. A bulk capacitance of approximately
10 µF needs to be in the near vicinity of the
LM32.
4 SWD SensorPath Bus line; Open-drain
output
Super I/O, Pull-up resistor, 1.6k
5 ADD Digital input - device number select
input for the serial bus device
number
Pull-up to 3.3 V or pull-down to GND resistor,
10k; must never be left floating
8, 10 D1-, D2- Thermal diode analog voltage
output and negative monitoring
input
Remote Thermal Diode cathode
(THERM_DC) - Diode 1 should always be
connected to the processor thermal diode.
Diode 2 may be connected to an MMBT3904
or GPU thermal diode. A 100 pF capacitor
should be connected between respective D-
and D+ for noise filtering.
9, 11 D1+, D2+ Thermal diode analog current
output and positive monitoring input
Remote Thermal Diode anode (THERM_DA) -
Diode 1 should always be connected to the
processor thermal diode. Diode 2 may be
connected to an MMBT3904 or GPU thermal
diode. A 100 pF capacitor should be
connected between respective D- and D+ for
noise filtering.
LM32
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