Rainbow Electronics MAX17062 - Manual (Page 12)

MAX17062
3) Place the feedback voltage-divider-resistors as
close to the FB pin as possible. The divider’s center
trace should be kept short. Placing the resistors far
away causes the FB trace to become an antenna
that can pick up switching noise. Avoid running the
feedback trace near LX.
4) Place the IN pin bypass capacitor as close to the
device as possible. The ground connection of the
IN bypass capacitor should be connected directly
to AGND pins with a wide trace.
5) Minimize the length and maximize the width of the
traces between the output capacitors and the load
for best transient responses.
6) Minimize the size of the LX node while keeping it
wide and short. Keep the LX node away from the
feedback node and analog ground. Use DC traces
as a shield if necessary.
Refer to the MAX17062 Evaluation Kit for an example of
proper board layout.
Chip Information
TRANSISTOR COUNT: 3612
PROCESS: BiCMOS
TFT-LCD Step-Up DC-DC Converter
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