Chip information – Rainbow Electronics MAX5233 User Manual

Page 16

MAX5232/MAX5233

Power-Supply and Bypassing

Considerations

On power-up, the input and DAC registers are cleared
to either zero (RSTV = DGND) or midscale (RSTV =
V

). Bypass V

with a 4.7µF capacitor in parallel

with a 0.1µF capacitor to AGND, and bypass V

with

a 0.1µF capacitor to DGND. Minimize lead lengths to
reduce lead inductance.

Grounding and Layout Considerations

Digital and AC transient signals on AGND or DGND can
create noise at the output. Connect AGND and DGND
to the highest quality ground available. Use proper

grounding techniques, such as a multilayer board with a
low-inductance ground plane or star connect all ground
return paths back to the MAX5232/MAX5233 AGND.
Carefully lay out the traces between channels to reduce
AC cross-coupling and crosstalk. Wire-wrapped boards
and sockets are not recommended. If noise becomes
an issue, shielding may be required.

Chip Information

TRANSISTOR COUNT: 4745

PROCESS: BiCMOS

3V/5V, 10-Bit, Serial Voltage-Output Dual DACs
with Internal Reference

______________________________________________________________________________________

TO OTHER
SERIAL DEVICES

MAX5232
MAX5233

DIN

SCLK

MAX5232
MAX5233

DIN

SCLK

MAX5232
MAX5233

DIN

SCLK

DIN

SCLK

CS1

CS2

CS3

Figure 9. Multiple MAX5230/MAX5231s Sharing a Common DIN Line

TO OTHER
SERIAL DEVICES

MAX5232
MAX5233

DIN

SCLK

MAX5232
MAX5233

DIN

DOUT

SCLK

DIN

SCLK

DIN

Figure 10. Daisy-Chaining MAX5230/MAX5231 Devices