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Rainbow Electronics MAX4889C User Manual

Page 2

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MAX4889B/MAX4889C

2.5/5.0Gbps PCIe Passive Switches

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(V

CC

= +3.3V ±10%, T

A

=T

MIN

to T

MAX,

unless otherwise noted. Typical values are at V

CC

= +3.3V, T

A

= +25°C, unless otherwise

noted.) (Note 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND, unless otherwise noted.)
V

CC

...........................................................................-0.3V to +4V

SEL, _IN_, _OUTA_, _OUTB_ (Note 1) .......-0.3V to (V

CC

+ 0.3V)

Continuous Current (AIN_ to AOUTA_/AOUTB_, BIN_ to

BOUTA_/BOUTB_, CIN_ to COUTA_/COUTB_, DIN_ to
DOUTA_/DOUTB_)........................................................±70mA

Peak Current (AIN_ to AOUTA_/AOUTB_, BIN_ to

BOUTA_/BOUTB_, CIN_ to COUTA_/COUTB_, DIN_ to

DOUTA_/DOUTB_)

(pulsed at 1ms, 10% duty cycle)..............................±70mA

Continuous Current (SEL).................................................±10mA
Peak Current (SEL)

(pulsed at 1ms, 10% duty cycle)..................................±10mA

Continuous Power Dissipation (T

A

= +70°C) for multilayer board:

42-Pin TQFN (derate 35.7mW/°C above +70°C) .......2857mW

Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Package Junction-to-Ambient Thermal Resistance

(

θ

JA

) (Note 2) ............................................................28.0°C/W

Package Junction-to-Case Thermal Resistance

(

θ

JC

) (Note 2) ..............................................................2.0°C/W

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC PERFORMANCE

Analog Signal Range

_IN_,

_OUTA_,

_OUTB_

-0.3

V

CC

-

1.8

V

On-Resistance

R

ON

V

CC

= +3.0V, I

_IN_

= 15mA, V

_OUTA_

,

V

_OUTB_

= 0V, 1.2V

6.4

8.4

Ω

On-Resistance Match Between
Pairs of Same Channel

ΔR

ON

V

CC

= +3.0V, I

_IN_

= 15mA, V

_OUTA_

,

V

_OUTB_

= 0V (Notes 4, 5)

0.1

0.5

Ω

On-Resistance Match Between
Channels

ΔR

ON

V

CC

= +3.0V, I

_IN_

= 15mA, V

_OUTA_

,

V

_OUTB_

= 0V (Notes 4, 5)

0.2

Ω

On-Resistance Flatness

R

FLAT (ON)

V

CC

= +3.0V, I

_IN_

= 15mA, V

_OUTA_

,

V

_OUTB_

= 0V, 1.2V (Notes 5, 6)

0.3

Ω

_OUTA_ or _OUTB_ Off-Leakage
Current

I

_ OU TA _ ( OF F)

,

I

_ OU TB _ ( OF F)

V

CC

= +3.6V , V

_IN_

= 0V, 1.2V, V

_OUTA_

or V

_OUTB_

= 1.2V, 0V (MAX4889B)

-1

+1

µA

_IN_ On-Leakage Current

I

_IN_ (ON)

V

CC

= +3.6V , V

_IN_

= 0V, 1.2V, V

_OUTA_

or V

_OUTB_

= V

_IN_

or unconnected

(MAX4889B)

-1

+1

µA

Output Short-Circuit Current

All other ports are unconnected
(MAX4889C)

5

15

µA

Output Open-Circuit Voltage

All other ports are unconnected
(MAX4889C)

0.2

0.6

0.9

V

Note 1: Signals on SEL, _IN_, _OUTA_, _OUTB_ exceeding V

CC

or GND are clamped by internal diodes. Limit forward-diode current

to maximum current rating.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer

board. For detailed information on package thermal considerations, refer to

www.maxim-ic.com/thermal-tutorial

.