Rainbow Electronics MAX16021 User Manual
Page 2
MAX16016/MAX16020/MAX16021
Low-Power µP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= 1.53V to 5.5V, V
BATT
= 3V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, BATT, OUT, BATT_TEST to GND.....................-0.3V to +6V
RESET, RESET, PFO, BATTOK, WDO, BATTON,
BATT_TEST, LL, (all open-drain) to GND .....................-0.3V to +6V
RESET, RESET, BATTOK, WDO, BATTON,
LL (all push-pull) to GND......................-0.3V to (V
OUT
+ 0.3V)
WDI, PFI to GND.......................................-0.3V to (V
OUT
+ 0.3V)
CEIN, CEOUT to GND ..............................-0.3V to (V
OUT
+ 0.3V)
MR to GND .................................................-0.3V to (V
CC
+ 0.3V)
Input Current
V
CC
Peak Current.................................................................1A
V
CC
Continuous Current ...............................................250mA
BATT Peak Current .......................................................500mA
BATT Continuous Current ...............................................70mA
Output Current
OUT Short Circuit to GND Duration ....................................10s
RESET, RESET, BATTON ....................................................20mA
Continuous Power Dissipation (T
A
= +70°C)
10-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
16-Pin TQFN (derate 25mW/°C above +70°C) ..........2000mW
Thermal Resistance (Note 1)
For 10-Pin TDFN
θ
JA
................................................................................41°C/W
For 16-Pin TQFN
θ
JA
................................................................................40°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
(Note 3)
V
CC,
V
BATT
V
CC
or V
BATT
> V
TH
0
5.5
V
V
CC
= 1.62V
1.2
2
V
CC
= 2.8V
1.9
3
V
CC
= 3.6V
2.3
3.5
Supply Current
I
CC
V
CC
> V
TH
V
CC
= 5.5V
3.4
5
µA
Supply Current in
Battery-Backup Mode
I
BATT
V
CC
= 0V
0.25
0.5
µA
V
CC
Switchover Threshold
Voltage
V
CC
rising, V
CC
- V
BATT
0.1
x V
CC
V
BATT Switchover Threshold
Voltage
V
CC
falling, V
CC
< V
TH
, V
CC
- V
BATT
0
mV
BATT Standby Current
V
CC
> V
BATT
+ 0.2V
-10
+10
nA
BATT Freshness Leakage
Current
V
BATT
= 5.5V
20
nA
V
CC
= 4.75V, I
OUT
= 150mA
1.4
4.5
V
CC
= 3.15V, I
OUT
= 65mA
1.7
4.5
V
CC
= 2.35V, I
OUT
= 25mA
2.1
5.0
V
CC
to OUT On-Resistance
R
ON
V
CC
= 1.91V, I
OUT
= 10mA
2.6
5.5
Ω
V
BATT
= 4.5V, I
OUT
= 20mA
V
BATT
- 0.1
Output Voltage in
Battery-Backup Mode
V
OUT
V
BATT
= 2.5V, I
OUT
= 20mA
V
BATT
- 0.15
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial
.