C&H Technology HFA50PA60C - Manual (Page 2)

www.vishay.com For technical questions, contact: [email protected] Document Number: 93096
2 Revision: 29-Jul-08
HFA50PA60C
Vishay High Power Products HEXFRED ®
Ultrafast, Soft Recovery Diode, 2 x 25 A
ELECTRICAL SPECIFICATIONS PER LEG (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
V
BR
I
R
= 100 µA 600 - -
V
Maximum forward voltage V
FM
I
F
= 25 A
See fig. 1
- 1.3 1.7
I
F
= 50 A - 1.5 2.0
I
F
= 25 A, T
J
= 125 °C - 1.3 1.7
Maximum reverse
leakage current
I
RM
V
R
= V
R
rated
See fig. 2
- 1.5 20
µA
T
J
= 125 °C, V
R
= 0.8 x V
R
rated - 600 2000
Junction capacitance C
T
V
R
= 200 V See fig. 3 - 55 100 pF
Series inductance L
S
Measured lead to lead 5 mm from package body - 12 - nH
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5, 10
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V - 23 -
ns t
rr1
T
J
= 25 °C
I
F
= 25 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
- 50 75
t
rr2
T
J
= 125 °C - 105 160
Peak recovery current
See fig. 6 I
RRM1
T
J
= 25 °C - 4.5 10
A
I
RRM2
T
J
= 125 °C - 8.0 15
Reverse recovery charge
See fig. 7 Q
rr1
T
J
= 25 °C - 112 375
nC
Q
rr2
T
J
= 125 °C - 420 1200
Peak rate of fall of recovery
current during t
b
See fig. 8
dI
(rec)M
/dt1 T
J
= 25 °C - 250 -
A/µs
dI
(rec)M
/dt2 T
J
= 125 °C - 160 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
lead
0.063" from case (1.6 mm) for 10 s - - 300 °C
Junction to case,
single leg conducting
R
thJC
- - 0.83
K/W
Junction to case,
both legs conducting
- - 0.42
Thermal resistance,
junction to ambient
R
thJA
Typical socket mount - - 40
Thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased - 0.25 -
Weight
- 6.0 - g
- 0.21 - oz.
Mounting torque
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
Marking device Case style TO-247AC HFA50PA60C