Vishay high power products, Hexfred, Ultrafast soft recovery diode, 210 a – C&H Technology HFA210NJ60CPbF User Manual
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Document Number: 94062
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Revision: 01-Aug-08
HFA210NJ60CPbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery
Diode, 210 A
Note
(1)
Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.
Gradually tighten each mounting bolt in 5 to 10 lbf
⋅ in steps until desired or maximum torque limits are reached
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL
TEST
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Reverse recovery time
See fig. 5
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V
-
35
-
ns
T
J
= 25 °C
I
F
= 105 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
-
90
140
T
J
= 125 °C
-
160
240
Peak recovery current
See fig. 6
I
RRM
T
J
= 25 °C
-
10
18
A
T
J
= 125 °C
-
15
30
Reverse recovery charge
See fig. 7
Q
rr
T
J
= 25 °C
-
450
1300
nC
T
J
= 125 °C
-
1200
3600
Peak rate of recovery current
See fig. 8
dI
(rec)M
/dt
T
J
= 25 °C
-
310
-
A/µs
T
J
= 125 °C
-
240
-
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL
MIN.
TYP.
MAX.
UNITS
Maximum junction and storage temperature range
T
J
, T
Stg
- 55
-
150
°C
Thermal resistance, junction to case
per leg
R
thJC
-
-
0.27
°C/W
K/W
per module
-
-
0.135
Typical thermal resistance, case to heatsink
R
thCS
-
0.10
-
Weight
-
68
-
g
-
2.4
-
oz.
Mounting torque
(1)
30 (3.4)
-
40 (4.6)
N
⋅ m
(lbf
⋅ in)
Mounting torque center hole
12 (1.4)
-
18 (2.1)
Terminal torque
30 (3.4)
-
40 (4.6)
Vertical pull
-
-
80
lbf
⋅ in
2" lever pull
-
-
35