Vishay semiconductors – C&H Technology VSKDS201-045 User Manual
Page 3
VSKDS201/045
www.vishay.com
Vishay Semiconductors
Revision: 04-Jan12
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Document Number: 93234
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum average forward current per leg
I
F(AV)
50 % duty cycle at T
C
= 123 °C, rectangular waveform
100
A
Maximum peak one cycle non-repetitive
surge current
I
FSM
5 μs sine or 3 μs rect. pulse
Following any rated
load condition and with
rated V
RRM
applied
8600
10 ms sine or 6 ms rect. pulse
1850
Non-repetitive avalanche energy
E
AS
T
J
= 25 °C, I
AS
= 24 A, L = 1 mH
270
mJ
Repetitive avalanche current
I
AR
Current decaying linearly to zero in 1 μs
Frequency limited by T
J
maximum V
A
= 1.5 x V
R
typical
20
A
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum forward voltage drop
V
FM
100 A
T
J
= 25 °C
0.72
V
200 A
1.04
100 A
T
J
= 125 °C
0.69
200 A
0.98
Maximum reverse leakage current
I
RM
T
J
= 25 °C
V
R
= Rated V
R
10
mA
T
J
= 125 °C
90
Maximum junction capacitance
C
T
V
R
= 5 V
DC
(test signal range 100 kHz to 1 MHz), 25 °C
5200
pF
Typical series inductance
L
S
Measured lead to lead 5 mm from package body
7.0
nH
Maximum voltage rate of change
dV/dt
Rated V
R
10 000
V/μs
Maximum RMS insulation voltage
V
INS
50 Hz
3000 (1 min)
3600 (1 s)
V
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL
TEST
CONDITIONS
VALUES
UNITS
Maximum junction and storage
temperature range
T
J
, T
Stg
- 55 to 175
°C
Maximum thermal resistance,
junction to case per leg
R
thJC
DC
operation
0.52
°C/W
Typical thermal resistance,
case to heatsink per module
R
thCS
0.1
Approximate weight
75
g
2.7
oz.
Mounting torque ± 10 %
to heatsink
A mounting compound is recommended and the torque
should be rechecked after a period of 3 hours to allow for
the spread of the compound.
4
Nm
busbar
3
Case style
JEDEC
TO-240AA compatible