Philips BGY148A - Manual (Page 8)

1998 May 13 8
Philips Semiconductors Product specification
HF amplifier modules BGY148A; BGY148B
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250
°
C and damage the module.
The maximum allowed temperature is 250
°
C for
5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Cleaning
The following fluids may be used for cleaning:
•
Alcohol
•
Bio-Act (Terpene Hydrocarbon)
•
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Fig.17 Recommended reflow temperature profile.
handbook, halfpage
0
300
200
100
0
1 5 2 3 4
MGM159
t (min)
T
( ° C)