Philips BGM1012 - Manual (Page 10)

2002 Sep 06 10
NXP Semiconductors Product specification
MMIC wideband amplifier BGM1012
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT363 SC-88
w B M bp
D
e1
e
pin 1
index
A
A1
Lp
Q
detail X
HE
E
v M A
A B
y
0 1 2 mm
scale
c
X
1 3 2
4 5 6
Plastic surface-mounted package; 6 leads SOT363
UNIT
A1
max
bp c D E e
1
HE Lp Q y w v
mm 0.1
0.30
0.20 2.2
1.8 0.25
0.10 1.35
1.15
0.65
e
1.3
2.2
2.0
0.2 0.1 0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
04-11-08
06-03-16