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Package outlines, Sot117-1, Smart card interface tda8001 – Philips TDA8001 User Manual

Page 20

background image

1996 Dec 12

20

Philips Semiconductors

Product specification

Smart card interface

TDA8001

PACKAGE OUTLINES

UNIT

A

max.

1

2

b

1

(1)

(1)

(1)

c

D

E

w

e

M

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT117-1

92-11-17
95-01-14

A

min.

A

max.

b

Z

max.

M

E

e

1

1.7
1.3

0.53
0.38

0.32
0.23

36.0
35.0

14.1
13.7

3.9
3.4

0.25

2.54

15.24

15.80
15.24

17.15
15.90

1.7

5.1

0.51

4.0

0.066
0.051

0.020
0.014

0.013
0.009

1.41
1.34

0.56
0.54

0.15
0.13

0.01

0.10

0.60

0.62
0.60

0.68
0.63

0.067

0.20

0.020

0.16

051G05

MO-015AH

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w

M

b

1

e

D

A

2

Z

28

1

15

14

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1