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Handling, Thermal characteristics, Smart card interface tda8001 – Philips TDA8001 User Manual

Page 13

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1996 Dec 12

13

Philips Semiconductors

Product specification

Smart card interface

TDA8001

Fig.10 Power derating curve (DIP28).

handbook, halfpage

4

3

1

0

2

MBE256

50

0

50

100

150

Ptot

(W)

T ( C)

amb

o

Fig.11 Power derating curve (SO28).

handbook, halfpage

50

3

2

1

0

0

MBE255

50

100

150

Ptot

(W)

T ( C)

amb

o

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500

, 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

VALUE

UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SOT117-1

30

K/W

SOT136-1

70

K/W