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Application information, Ic card interf ace td a8002c, Fig.16 application diagram – Philips TDA8002C User Manual

Page 22

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1999

Oct

12

22

Philips Semiconductors

Product specification

IC card interf

ace

TD
A8002C

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APPLICA

TION INFORMA

TION

u

ll pagewidth

FCE195

C8
10

µ

F

C4

(3)

100 nF

C3

(2)

100

nF

C5

(4)

470 nF

C7

100 nF

C6

(5)

470 nF

80C51

P1-0

P1-1

P1-2

P1-3

P1-4

P1-5

P1-6

P1-7

RST

P3-0

P3-1

P3-2

P3-3

P3-4

P3-5

P3-6

P3-7

XTAL2

XTAL1

VSS

VCC

P0-0

P0-1

P0-2

P0-3

P0-4

P0-5

P0-6

P0-7

EA

ALE

PSEN

P2-7

P2-6

P2-5

P2-4

P2-3

P2-2

P2-1

P2-0

XTAL1

XTAL2

I/OUC

AUX1UC

CS

ALARM

CLKSEL

CLKDIV1

CLKDIV2

STROBE

CLKOUT

DGND1

AGND

S2

IC2

IC1

MODE

OFF

RSTIN

CMDVCC

RST

CLK

VCC

AUX1

PRES

I/O

VUP

S1

VDDA

VDD

1

2

3

4

5

6

7

8

9

10

11

12

13

28

27

26

25

24

23

22

21

20

19

28

27

26

25

24

23

22

21

30

29

38

37

36

35

34

33

32

31

40

39

18

17

16

15

14

1

2

3

4

5

15

6

7

8

9

10

16

17

18

19

20

11

12

13

14

TDA8002CT/C

CV/TV

C5I

C6I

C7I

C8I

C1I

C2I

C3I

C4I

C4

C3

C2

C1

C8

C7

C6

C5

(1)

K1

K2

33 pF

33 pF

14.745

MHz

VDD

C2
10

µ

F

C1

100 nF

VDD

J1 1

3.3 V or 5 V

J1 2

ground

CARD READ

Fig.16 Application diagram.

TDA8002C should be placed as close as possible to the card reader.

(1) Contact normally open.

(2) C3 close to pin V

CC

of TDA8002C.

(3) C4 close to C1 contact of card reader.

(4) C5 close to VUP pin of TDA8002C.

(5) C6 as close as possible to pins S1 and S2.

CLK line may be shielded with respect to other lines.

Decoupling capacitors C7 and C8 may be placed as close as possible to pin V

DDA

.

A good ground plane is recommended.