Philips BGY2016 - Manual (Page 4)

2000 Oct 17 4
Philips Semiconductors Product specification
UHF amplifier module BGY2016
APPLICATION INFORMATION
List of components (See Figs 2 and 3)
Note
1. The striplines are on a double copper-clad printed-circuit board (RO5880) with
ε
r
= 2.2 and thickness = 0.79 mm.
COMPONENT DESCRIPTION VALUE CATALOGUE NO.
C1, C2 electrolytic capacitor 10
µ
F; 35 V
−
C3, C4 multilayer ceramic chip capacitor 10 nF; 50 V
−
C5, C6 multilayer ceramic chip capacitor 100 pF; 50 V
−
C7, C8 multilayer ceramic chip capacitor 10 pF; 50 V
−
L1, L2 Grade 4S2 Ferroxcube bead
−
4330 030 36300
R1, R2 metal film resistor 10
Ω
; 0.4 W 2322 195 13109
Z
1
, Z
2
stripline; note 1 50
Ω −
handbook, full pagewidth
MGM861
C8
C6
R2 L2 Z2
C4
C2
VS2 50 Ω
output
C7
C5
R1 L1
C3
C1
VS1
Z1
50
Ω
input
Fig.2 Test circuit.