Symbol Technologies MC70 - Manual (Page 140)

A - 2 MC70 User Guide
Operating System
Microsoft ® Windows Mobile™ 2005
Memory 64MB RAM/128MB ROM
Interface/Communications RS-232, USB 1.1
User Environment
Operating Temperature 14°F to 155°F / -10°C to 68°C
Storage Temperature -40° F to 140° F / -40° C to 60° C
Charging Temperature 32°F to 104°F / 0° C to 40° C
Humidity 95% non-condensing
Drop Specification 4 ft. drop to concrete, 6 drops per 6 sides over operating temperature range;
5 ft. drop to concrete, 2 drops per 6 sides at ambient temperature 73° F/23° C
Electrostatic Discharge (ESD) +/-15kVdc air discharge, +/-8kVdc direct discharge, +/-8kVdc indirect discharge
Sealing IP54
Wireless WAN Data and Voice Communications
Wireless Wide Area (WWAN) radio eGPRS/GSM (850, 900, 1800 and 1900 MHz)
Wireless LAN Data and Voice Communications
Wireless Local Area (WLAN) radio Tri-mode IEEE ® 802.11a/b/g
Data Rates Supported 1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54 Mbps
Operating Channels Chan 8-169 (5040 – 5845 MHz) (4920 – 4980 MHz) Japan only
Chan 1-13 (2412-2472 MHz) Chan 14 (2484 MHz) Japan only
Actual operating frequencies depend on regulatory rules and certification agency
Security WPA, WEP (40 or 128 bit), TKIP, TLS, TTLS (MS-CHAP), TTLS (MS-CHAP v2), TTLS
(CHAP), TTLS-MD5, TTLS-PAP, PEAP-TLS, PEAP (MS-CHAP v2), AES, LEAP
Spreading Technique Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency Division
Multiplexing (OFDM)
Antenna Internal for LAN, External for WAN
Voice Communication Integrated Voice-over-IP ready (P2P, PBX, PTT), Wi-Fi™-certified, IEEE 802.11a/b/g direct
sequence wireless LAN
Wireless PAN Data and Voice Communications
Bluetooth Class II, v 1.2
Data Capture Specifications
Options 2D imager, 1D linear
Table A-1 EDA Technical Specifications (Continued)
Item Description