2 package thermal specifications, Table 8.2 128-pin tqfp package thermal parameters, Package thermal specifications – SMSC USB2601 User Manual
Page 28: Datasheet
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08)
28
SMSC USB2601/USB2602
DATASHEET
8.2
Package Thermal Specifications
Table 8.2 128-Pin TQFP Package Thermal Parameters
PARAMETER
SYMBOL
VALUE
UNIT
COMMENTS
Thermal Resistance
Θ
JA
53.1
o
C/W
From the die to the ambient air
Junction-to-Top-of-Package
Θ
JT
0.3
o
C/W
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