Chapter 8 package information, 1 package outline, Chapter 8 – SMSC USB2601 User Manual
Page 27: Package information, Package outline, Datasheet
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602
27
Revision 1.6 (06-20-08)
DATASHEET
Chapter 8 Package Information
8.1
Package Outline
Figure 8.1 USB2601/USB2602 128-Pin TQFP Package Outline
Notes:
1.
Controlling Unit: millimeter.
2.
Tolerance on the true position of the leads is ± 0.035 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
3.
Maximum mold protrusion is 0.25 mm.
4.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5.
Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 8.1 USB2601/USB2602 128-Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
1.20
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
0.95
~
1.05
Body Thickness
D
15.80
~
16.20
X Span
D1
13.80
~
14.20
X body Size
E
15.80
~
16.20
Y Span
E1
13.80
~
14.20
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00
~
Lead Length
e
0.40 Basic
Lead Pitch
q
0
o
~
7
o
Lead Foot Angle
W
0.13
0.18
0.23
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity