Daewoo L510B1 - Manual (Page 7)

5
FIGURE 1. USE SOLDERING IRON TO PRY LEADS
◆ IC Removal/Replacement
Some utilized chassis circuit boards have slotted (oblong) holes through which the IC leads are inserted
and then bent flat against the circuit foil. When holes are slotted, the following technique should be used
to remove and replace the IC. When working with boards using the familiar round hole, use the standard
technique as outlined in paragraphs 5 on the page under the title of general soldering guidelines.
◆ Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the
soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with
desoldering braid before removing the IC.
◆ Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (lt is not necessary to reapply acrylic coating
to the area).
◆ “Small-Signal” Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend the ends of each of three leads remaining on the circuit board into a “U” shape.
3. Bend the replacement transistor leads into a “U” shape.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board
and crimp the “U” with long nose pliers to ensure metal-to-metal contact, then solder each connection.
◆ Power IC, Transistor or Devices Removal/Replacement
1. Heat and remove all solders from the device leads.
2. Remove the heatsink mounting screw (if applicable).
3. Carefully remove the device from the circuit board.
4. Insert new device in circuit board.
5. Solder each device lead and then clip off excess lead.
6. Replace heatsink.