BECKHOFF CB3053 - Manual (Page 12)

Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB3053
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
§ PCI Specification
Version 2.3 resp. 3.0
www.pcisig.com
§ ACPI Specification
Version 3.0
www.acpi.info
§ ATA/ATAPI Specification
Version 7 Rev. 1
www.t13.org
§ USB Specifications
www.usb.org
§ SM-Bus Specification
Version 2.0
www.smbus.org
§ Intel® Chipset Documentation
SCH Datasheet
www.intel.com
§ Intel® Chip Documentation
Atom Datasheet
www.intel.com
§ Winbond® Chip Documentation
W83627HG
www.winbond-usa.com oder www.winbond.com.tw
§ Intel® Chip Documentation
82575EB Datasheet
www.intel.com