beautypg.com

Compaq COM Express Extension User Manual

Page 7

background image

2 Introduction

Copyright © COM Express™ Extension

Specification Rev 013

7

Differential Signalling) interfaces. These include the PCI bus and parallel ATA on the one hand and

PCI Express and Serial ATA on the other hand.

Key features include:

Rich complement of contemporary high bandwidth serial interfaces, including PCI

Express, Serial ATA, USB 2.0, and Gigabit Ethernet

32-bit PCI, LPC and Parallel ATA options preserved for easy interface to a range of

peripherals

Extended power-management capabilities

Robust thermal and mechanical concept

Cost-effective design

Legacy-free design (no Super I/O, PS2 keyboard or mouse)

COM Express™ module size with two currently defined footprint options (“Basic”

and “Extended”) to satisfy a range of performance requirements. The option for

future more compact footprints like microETXexpress and nanoETXexpress are

present.

High-performance mezzanine connector with several defined pin-out types to

satisfy a range of application requirements

The COM Express

Extension specification has been created to support to a range of vertical

embedded markets. It has been formulated to be applicable to a broad range of system types, from

floor-installed and bench-top to mobile handheld.

Markets and applications include but are not limited to:

Healthcare - clinical diagnostic imaging systems, patient bedside monitors, etc.

Retail & advertising - electronic shopping carts, billboards, kiosks, POS/POI

systems, etc.

Gaming & entertainment - simulators, slot machines, etc.

Test & measurement - scientific and industrial test and measurement instruments

Industrial automation - industrial robots, vision systems, etc.

Security - digital CCTV, luggage scanners, intrusion detectors, etc.

Defence & government - unmanned vehicles, rugged laptops, wearable computers,

etc.

Systems developed according to the COM Express

Extension Specification require the

implementation of an application-specific carrier board that accepts the module. The carrier board is

typically a 4- to 8-layer PCB. User-specific features such as external connector choices and locations

and peripheral circuits can be tailored to suit the application. The OEM can focus on application-