General information ddr3 sdram, October 2009, Ddr3 sdram module ordering information – Samsung DDR3 User Manual
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General Information
DDR3 SDRAM
3. DDR3 SDRAM Module Ordering Information
1 2
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
6
7
8
9
10
11 12
X X X X X - X X X
# of Banks in Comp. & Interface
Bit Organization
Speed
Temp & Power
PCB Revision
Package
Component Revision
1. Memory Module : M
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
8. Component Revision
M :
1st Gen.
A :
2nd Gen
B :
3rd Gen.
C :
4th Gen.
D :
5th Gen.
E :
6th Gen.
F :
7th Gen.
G :
8th Gen.
9. Package
71
78
91
92
93
x64 204pin Unbuffered SODIMM
x64 240pin Unbuffered DIMM
x72 240pin ECC unbuffered DIMM
x72 240pin VLP Registered DIMM
x72 240pin Registered DIMM
Z
H
J
M
FBGA(Lead-free)
FBGA(Lead-free & Halogen-free)
FBGA(Lead-free, DDP)
FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0 : None
1 : 1st Rev.
2 : 2nd Rev.
3 : 3rd Rev.
4. DRAM Component Type
4 : 4th Rev.
S
Reduced Layer
B : DDR3 SDRAM (1.5V VDD)
5. Depth
32 : 32M
33
64 : 64M
65
28 : 128M
29
56 : 256M
57
51 : 512M
52
1G : 1G
1K
2G : 2G
2K
: 32M (for 128Mb/512Mb)
: 64M (for 128Mb/512Mb)
: 128M (for 128Mb/512Mb)
: 256M (for 512Mb/2Gb)
: 512M (for 512Mb/2Gb)
: 1G (for 2Gb)
: 2G (for 2Gb)
11. Temp & Power
C : Commercial Temp.(
Y : Commercial Temp.(
0°C ~ 85°C) & Normal Power
0°C ~ 85°C) & Low VDD(1.35V)
6. # of Banks in comp. & Interface
12. Speed
F7
F8
H9
K0
DDR3-800
(400MHz @ CL=6, tRCD=6, tRP=6)
DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
7
8Banks & SSTL-1.5V
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0
: x 4
3
: x 8
4
: x16
October 2009
ELECTRONICS
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