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Chapter 1: product introduction 1-14 – Asus M4N68T-M User Manual

Page 24

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DDR3-1333MHz capability

Vendor

Part No.

Size

SS/

DS

Brand Chip NO.

Timing

DIMM

(BIOS)

Voltage

DIMM

Support

A* B*

G.SKILL

F3-10600CL8D-2GBHK

1024MB

SS G.SKILL Heat-Sink Package

G.SKILL

F3-10600CL9D-2GBPK

1024MB

SS G.SKILL Heat-Sink Package

G.SKILL

F3-10666CL7T-3GBPK

3072MB(Kit of 3) SS

N/A

Heat-Sink Package

7-7-7-18 1.5~1.6V

G.SKILL

F3-10666CL9T-3GBNQ

3072MB(Kit of 3) SS

N/A

Heat-Sink Package

9-9-9-24 1.5~1.6V

G.SKILL

F3-10600CL7D-2GBPI

1024MB

DS G.SKILL Heat-Sink Package

G.SKILL

F3-10600CL9D-2GBNQ

1024MB

DS G.SKILL Heat-Sink Package

G.SkiLL

F3-10666CL8D-4GBHK

4096MB(Kit of 2 ) DS

N/A

Heat-Sink Package

8-8-8-21 1.5-1.6V

G.SKILL

F3-10666CL7T-6GBPK

6144MB(Kit of 3 ) DS

N/A

Heat-Sink Package

7-7-7-18 1.5~1.6V

G.SKILL

F3-10666CL9T-6GBNQ

6144MB(Kit of 3) DS

N/A

Heat-Sink Package

9-9-9-24 1.5V~1.6V •

GEIL

DDR3-1333 CL9-9-9-24

1024MB

SS

N/A

Heat-Sink Package

9

GEIL

GV34GB1333C7DC

2048MB

DS

N/A

Heat-Sink Package

7-7-7-24

1.5V

GEIL

GG34GB1333C9DC

4096MB(Kit of 2) DS

GEIL

GL1L128M88BA12N

9-9-9-24 1.3V(low

voltage)

GEIL

DDR3-1333 CL9-9-9-24

6144MB(Kit of 3 ) DS

N/A

Heat-Sink Package

9

1.5V

Kingmax

FLFD45F-B8MH9 MAES

1024MB

SS

Micron 9CF22D9KPT

Kingmax

FLFE85F-B8MF9

2048MB

DS

Micron 8HD22D9JNM

Kingmax

FLFE85F-B8MH9 MEES

2048MB

DS

Micron 9GF27D9KPT

Kingston

KVR1333D3N9/1G

1024MB

SS

Hynix

H5TQ1G83BFR

9

1.5V

Kingston

KVR1333D3N9/2G

2048MB

DS Qimonda IDSH1G-03A1F1C-13H

1.5V

Micron

MT8JTF12864AY-1G4D1

1024MB

SS

Micron 8LD22D9JNM

Micron

MT8JTF12864AZ-1G4F1

1024MB

SS

Micron 9FF22D9KPT

9

Micron

MT9JSF 12872AZ-1G4F1

1024MB

SS

Micron 91F22D9KPT(ECC)

9

Micron

MT8JTF12864AY-1G4D1

3072MB(Kit of 3) SS

Micron 8XD22D9JNM

9

Micron

MT12JSF25672AZ-1G4F1

2048MB

DS

Micron 91F22D9KPT(ECC)

9

Micron

MT16JTF25664AY-1G1D1

2048MB

DS

Micron 8LD22 D9JNM

Micron

MT18JTF25664AZ-1G4F1

2048MB

DS

Micron 9KF27D9KPT

9

Micron

MT16JTF25664AY-1G4D1

6144MB(Kit of 3 ) DS

Micron 8UD22D9JNM

9

OCZ

OCZ3X1333LV3GK(XMP)

3072MB(Kit of 3) SS

N/A

Heat-Sink Package

1.6V

OCZ

OCZ3G13334GK

4096MB(Kit of 2) DS

N/A

Heat-Sink Package

1.7V

OCZ

OCZ3P13334GK

4096MB(Kit of 2) DS

N/A

Heat-Sink Package

7-7-7-20

1.8V

OCZ

OCZ3G1333LV6GK

6144MB(Kit of 3 ) DS

N/A

Heat-Sink Package

9-9-9-20

1.65V

OCZ

OCZ3P1333LV6GK

6144MB(Kit of 3 ) DS

N/A

Heat-Sink Package

7-7-7-20

1.65V

OCZ

OCZ3X1333LV6GK(XMP)

6144MB(Kit of 3 ) DS

N/A

Heat-Sink Package

8-8-8-20

1.60V

SAMSUNG M378B2873DZ1-CH9

1024MB

SS Samsung K4B1G0846D-HCH9

SAMSUNG M378B2873DZ1-CH9

1024MB

SS Samsung SEC 846 HCH9 K4B1G08460

SAMSUNG M378B2873EH1-CH9

1024MB

SS Samsung SEC 913 HCH9 K4B1G0846E

SAMSUNG M391B2873DZ1-CH9

1024MB

SS Samsung K4B1G0846D-HCH9(ECC)

SAMSUNG M378B5673DZ1-CH9

2048MB

DS Samsung K4B1G0846D-HCH9

SAMSUNG M378B5673EH1-CH9

2048MB

DS Samsung SEC 913 HCH9 K4B1G0846E

SAMSUNG M391B5673DZ1-CH9

2048MB

DS Samsung K4B1G0846D-HCH9(ECC)

Super Talent W1333X2GB8

1024MB

SS

N/A

Heat-Sink Package

Transcend

TS128MLK64V3U

1024MB

SS

N/A

SEC 813HCH9 K4B1G0846D

Transcend

TS128MLK72V3U

1024MB

SS

N/A

K4B1G0846D(ECC)

Transcend

TS256MLK64V3U

2048MB

DS

Micron 9GF27D9KPT

Transcend

TS256MLK64V3U

2048MB

DS

N/A

SEC816HCH9K4B1G0846D

Chapter 1: Product introduction

1-14