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3 special features, 1 product highlights, Intel – Asus WIFI-AP P5E3 User Manual

Page 18: Core™ 2 quad processor ready, Core™2 duo/ intel, Core™2 extreme cpu support, Intel x38 chipset

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1-2

Chapter 1: Product Introduction

1.3

Special features

1.3.1

Product highlights

Intel

®

Core™ 2 Quad Processor Ready

This motherboard supports the latest Intel

®

Core™ 2 Quad processors in the

LGA775 package. It is excellent for multi-tasking, multi-media and enthusiastic

gamers with 1066 / 800 MHz FSB. The Intel

®

Core™ 2 Quad processor is one of

the most powerful CPUs in the world. This motherboard also supports Intel

®

CPUs

in the new 45 nm manufacturing process.

Intel

®

Core™2 Duo/ Intel

®

Core™2 Extreme CPU support

This motherboard supports the latest Intel

®

Core™2 processor in the LGA775

package. With the new Intel

®

Core™ microarchitecture technology and 1333/ 1066

/ 800 MHz FSB, the Intel

®

Core™2 is one of the most powerful and energy efficient

CPUs in the world.

Intel X38 Chipset

The Intel

®

X38 Express Chipset is the latest chipset designed to support 8GB of

dual-channel DDR3 1333/1066/800 architecture, 1333/1066/800 FSB (Front Side

Bus), dual PCI Express x16 graphics and multi-core CPUs. It especially includes

Intel

®

Fast Memory Access technology that significantly optimizes the use of

available memory bandwidth and reduces the latency of the memory accesses.

DDR3 memory support

The motherboard supports DDR3 memory that features data transfer rates of

1333 /1066 / 800 MHz to meet the higher bandwidth requirements of the latest

3D graphics, multimedia, and Internet applications. The dual-channel DDR3

architecture doubles the bandwidth of your system memory to boost system

performance. Furthermore, this motherboard does not restrict the memory size

across two channels. Users may install different memory size DIMMs into the two

channels and enjoy dual-channel and single-channel functions at the same time.

This new feature optimizes the use of available memory size. See page 2-13 for

details.