Implementation temperature specification – DMC TSC-40/IC User Manual
Page 17
Document No. DER-S0100A
16
Version 1.4 ©2012 DMC Co., Ltd.
TSC-40/IC Product Specification
80 to 150
C (Package surface temperature)
260
C max.
10s max. (Primary + Secondary flow
passage duration)
Time
T
empe
ratur
e
110
30s
175
15
C
1 to 4
C/s
220
C or above, 60s max.
255
C or above, 10-16s max.
260
C max.
Time
Pac
kage’
s s
urfac
e t
em
peratu
re
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow)
Frequency:
Three times or less
Temperature:
The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Wave soldering method (Flow soldering, solder dip method)
Frequency:
One time or less
Temperature:
Following temperature profile is recommended (Set the optimal preheat temperature
according to the flux type)
Figure 2: Wave soldering temperature profile
3. Soldering iron (Manual soldering)
Soldering bit
’s temperature:
370
C or lower
Soldering time:
Five seconds or less/terminal